Difference between revisions of "T7000"

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== Hardware ==
 
== Hardware ==
The A8 is manufactured using the TSMC 20nm HKMG process and has a die size of 89mm2. It contains a 4-core IMG PowerVR GX6450 GPU.
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The A8 part number is <code>APL1011</code>. It is manufactured using the TSMC 20nm HKMG process and has a die size of 89mm2. It contains a 4-core IMG PowerVR GX6450 GPU.
   
 
==Bootrom Exploits==
 
==Bootrom Exploits==

Revision as of 14:51, 24 September 2014

A8 chip.

The T7000 is the Apple A8 processor currently used in the iPhone 6 and iPhone 6 Plus. It is a 64-bit Apple-designed dual-core Cyclone ARMv8-A CPU running at 1.38 GHz.

Hardware

The A8 part number is APL1011. It is manufactured using the TSMC 20nm HKMG process and has a die size of 89mm2. It contains a 4-core IMG PowerVR GX6450 GPU.

Bootrom Exploits

There are no known exploits.

References

Hacking.png This hardware article is a "stub", an incomplete page. Please add more content to this article and remove this tag.