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Difference between revisions of "N82AP"
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==Internals== |
==Internals== |
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| + | <i>See: [[N82ap (Internals)]]</i> |
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| − | iFixit has a run down of all iPhone components [http://www.ifixit.com/Guide/First-Look/iPhone3G here] which includes some datasheets. |
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| − | Following is a tear down graphic by Semiconductor Insights reported about [http://www.techonline.com/product/underthehood/209000013;jsessionid=OE0PYVMJ22XYIQSNDLPCKH0CJUNN2JVN here]. |
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| − | '''Top side''' |
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| − | [[Image:Hardware3g.JPG]] |
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| − | '''Bottom side''' |
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| − | Note the updated CSR Bluetooth chip. Anyone has more info on the available profiles on this chip? |
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| − | [[Image:Hardware3G_bottom.jpg]] |
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| − | Important differences from the internals of original iPhone: |
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| − | -Battery is no longer soldered (Anyone have more? please add) |
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Revision as of 03:40, 29 July 2008
This is the iPhone 3G. It was released on July 11, 2008 with a price tag of $199 for the 8GB model and $299 for the 16GB model, in the US market. Price varies depending on the operator selling it. Features the inclusion of 3G networking and GPS, along with a tapered plastic back in black and white colors.
Internals
See: N82ap (Internals)
